Title:
A method for manufacturing a copper foil with a carrier, a method for manufacturing a copper foil with a carrier, a method for manufacturing a printed circuit board, a method for manufacturing a copper-clad laminate, and a method for manufacturing a printed wiring board.
Document Type and Number:
Japanese Patent JP6336142
Kind Code:
B2
Inventors:
Misato Honda
Yuta Nagaura
Yuta Nagaura
Application Number:
JP2017000787A
Publication Date:
June 06, 2018
Filing Date:
January 05, 2017
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C25D7/06; B32B15/01; B32B15/20; C25D1/04; C25D1/22; C25D5/12; C25D5/14; C25D5/16; C25D5/48; H05K1/09
Domestic Patent References:
| JP2005048277A | ||||
| JP2006022406A | ||||
| JP2007083713A |
Foreign References:
| WO2010027052A1 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation