Title:
ELASTIC MULTILAYER CIRCUIT BOARD, ELASTIC DISPLAY USING THE SAME, WEARABLE DEVICE OR BIOLOGICAL SENSOR, DISPLAY DEVICE AND METHOD OF MANUFACTURING ELASTIC MULTILAYER CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2022076292
Kind Code:
A
Abstract:
To provide an elastic multilayer circuit board which is excellent in the elastic electrical property.SOLUTION: An elastic multilayer circuit board of the present invention comprises a multilayer wiring structure including: a board; a plurality of pieces of lower wiring provided on the board; a lower insulating layer provided on the lower wiring; a plurality of pieces of upper wiring provided on the lower insulating layer; and an upper insulating layer provided on the upper wiring. Each of the board, lower wiring, lower insulating layer, upper wiring and upper insulating layer includes a thermosetting elastomer. The multilayer wiring structure includes an intersection structure in which the first lower wiring and the first upper wiring intersect each other when viewed in the vertical direction with respect to the one surface of the board, and a connection structure in which the first lower wiring and the first upper wiring can be electrically connected to each other.SELECTED DRAWING: Figure 1
Inventors:
HORIMOTO AKIHIRO
YAMANOI YUMIKO
OKADA JUN
YAMANOI YUMIKO
OKADA JUN
Application Number:
JP2020186641A
Publication Date:
May 19, 2022
Filing Date:
November 09, 2020
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
H05K3/46; H05K1/02; H05K1/03
Attorney, Agent or Firm:
Shinji Hayami
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