Title:
電子線硬化性樹脂組成物、リフレクター用樹脂フレーム、リフレクター、半導体発光装置、及び成形体の製造方法
Document Type and Number:
Japanese Patent JP5751260
Kind Code:
B2
Abstract:
Provided are an electron beam curable resin composition including polymethylpentene, and a crosslinking agent, in which the crosslinking agent has a saturated or unsaturated ring structure, at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and a molecular weight is 1,000 or less, a resin frame for reflectors using the resin composition, a reflector, and a molding method using the resin composition.
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Inventors:
Toshiyuki Sakai
Application Number:
JP2013006084A
Publication Date:
July 22, 2015
Filing Date:
January 17, 2013
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
C08L23/20; C08J7/00; C08K5/01; C08K5/12; C08K5/3492; C08K7/14; C08K7/18; H01L33/60
Domestic Patent References:
| JP60135415A | ||||
| JP54054332A | ||||
| JP5024109A | ||||
| JP2006008972A | ||||
| JP5295043A |
Foreign References:
| WO2011055803A1 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kenichi Hirasawa