Title:
A method for manufacturing the multilayer three-dimensional structure
Document Type and Number:
Japanese Patent JP5971312
Kind Code:
B2
Abstract:
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
Inventors:
Adam El Cohen
Application Number:
JP2014232626A
Publication Date:
August 17, 2016
Filing Date:
November 17, 2014
Export Citation:
Assignee:
University of Southern California
International Classes:
B81C1/00; C25D1/00; B21C37/00; C23F1/00; C25D1/10; C25D5/02; C25D5/10; C25D7/12; C25D17/06; C25D19/00; C25D21/12; H01L21/288; H05K3/24; C25D
Domestic Patent References:
| JP6045232A | ||||
| JP8176757A | ||||
| JP2000513768A |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office
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