Title:
共振空洞および前記共振空洞を製造する方法
Document Type and Number:
Japanese Patent JP4594441
Kind Code:
B2
Abstract:
A re-entrant resonant cavity 12 includes three parts 18, 19 and 20 which may be manufactured as metallized plastic components. The three parts 18, 19 and 20 are soldered to a multilayer PCB 23 using surface mount technology. The re-entrant stub 16 is in two portions with dielectric material provided by the PCB 23 between them. The cylindrical wall 13 surrounding the stub 16 is also divided into two sections 21 and 22 by the PCB 23. Vias 24 and 25 electrically connect the parts separated by the PCB 23. The pattern of the vias 24 and 25 determines the inductance of the cavity, and hence its resonance frequency. This enables cavities with the same geometry to be operated at different resonance frequencies by using different configurations of through connects. One of the sets of vias may be omitted in some cavities.
Inventors:
Hessel Bath, Jean
Application Number:
JP2009529186A
Publication Date:
December 08, 2010
Filing Date:
September 10, 2007
Export Citation:
Assignee:
Alcatel-Lucent USA Inc.
International Classes:
H01P7/04; H01P1/205; H01P11/00; H05K1/18
Domestic Patent References:
| JP55035560A | ||||
| JP62124449A | ||||
| JP2003110317A |
Attorney, Agent or Firm:
Masao Okabe
Nobuaki Kato
Okabe
Shinichi Usui
Takao Ochi
Asahi Shinmitsu
Katsumi Miyama
Nobuaki Kato
Okabe
Shinichi Usui
Takao Ochi
Asahi Shinmitsu
Katsumi Miyama