Title:
シリコン材料のダイヤモンドワイヤー切断時に副生したシリコンスラッジを利用してシリコン含有製品を製造する方法
Document Type and Number:
Japanese Patent JP6956251
Kind Code:
B2
Abstract:
The present application provides a method, a equipment and a system for producing a silicon-containing products by using a silicon sludge which is produced by a diamond wire cutting silicon material. The method of the present application mainly utilizes a high oxide layer on the surface of a silicon waste particle produced during diamond wire cutting. The characteristics are such that the surface oxide disproportionates with adjacent internal elemental silicon to form silicon monoxide to be removed in a vapor to achieve a physical chemical reaction with a metal, a halogen gas, a hydrogen halide gas or hydrogen to form a high value-added silicon-containing products. The process realizes the large-scale, high-efficiency, energy-saving, continuous and low-cost complete recycling of diamond-wire cutting silicon waste.
Inventors:
CHU,Xi
Application Number:
JP2020502752A
Publication Date:
November 02, 2021
Filing Date:
March 27, 2018
Export Citation:
Assignee:
CHU,Xi
International Classes:
C01B33/113
Domestic Patent References:
| JP2011121049A | ||||
| JP61068313A | ||||
| JP2002293528A | ||||
| JP2007053084A | ||||
| JP2004124199A | ||||
| JP61068310A | ||||
| JP2005330149A |
Foreign References:
| CN104229801A | ||||
| WO2006025194A1 | ||||
| CN104593040A | ||||
| CN103030424A |
Attorney, Agent or Firm:
Nijiiro Patent Office, a patent business corporation