Title:
A method and a movable type device for reducing the heat resistance between two solids
Document Type and Number:
Japanese Patent JP6239586
Kind Code:
B2
Inventors:
Bonnard, Jean Claude
Dure, Bernard
Dure, Bernard
Application Number:
JP2015502368A
Publication Date:
November 29, 2017
Filing Date:
March 28, 2013
Export Citation:
Assignee:
Comisaria Arenergy Atomique Eogene Luigi Arteana Teaf
International Classes:
G21C19/32
Domestic Patent References:
| JP2011102802A | ||||
| JP2010525309A | ||||
| JP2003315488A |
Foreign References:
| WO2011161233A1 |
Attorney, Agent or Firm:
Takahashi Hayashi & Partners