Title:
支持体に共有結合したポリアミド含有リガンド、ポリアミド含有樹脂および溶液から金属を取出すための方法
Document Type and Number:
Japanese Patent JP4897170
Kind Code:
B2
Abstract:
Compositions and methods for selectively binding metal ions from source solutions are disclosed. The compositions include 1) polyamide-containing ligands covalently bonded to a particulate solid support, and 2) polyamide-containing polymeric resins. In the case of the ligand bonded to the solid support, the ligand is bounded or tethered to the solid support through a hydrophilic spacer such that the overall formula is SS-A-X-L. In this formula, SS is a particulate solid support such as silica or a polymeric bead, A is a covalent linkage mechanism, X is a hydrophilic spacer grouping, and L is a polyamide-containing ligand having three or more amide groups and two or more amine nitrogens separated by at least two carbons with the proviso that when SS is a particulate organic polymer, A-X may be combined as a single covalent linkage. With respect to the polyamide ligand-containing polymeric resin, this composition is a reaction product of a hydroxymethylated polyamide ligand and a polymerization and/or crosslinking agent.
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Inventors:
Bruning, Ronald El
Krakowiak, Kurdisut Tof Yi
Krakowiak, Kurdisut Tof Yi
Application Number:
JP2001526273A
Publication Date:
March 14, 2012
Filing Date:
September 27, 2000
Export Citation:
Assignee:
IBC Advanced Technologies, Inc.
International Classes:
C07D273/08; C22B3/42; B01J45/00; C02F1/42; C07C237/08; C07C237/10; C07F7/08; C22B11/00; C22B13/00; C22B15/00; C22B17/00; C22B23/00; C22B26/20
Domestic Patent References:
| JP9511948A |
Attorney, Agent or Firm:
Kazuo Shamoto
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Tatsuo Tomizu
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Tatsuo Tomizu