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Title:
二層コート銅粉及びその二層コート銅粉の製造方法並びにその二層コート銅粉を用いた導電性ペースト
Document Type and Number:
Japanese Patent JP4197151
Kind Code:
B2
Abstract:

To provide copper powder which has satisfactory oxidation resistance and has excellent thermal shrinkage resistance in such a manner that its shrinkage on sintering is reduced in the temperature range where sintering is possible even if it is fine.

In the double layer-coated copper powder obtained by providing the surfaces of the particulate matters of copper powder as the core material with an inorganic matter coat layer, the surfaces of the particulate matters of copper powder as the core material are provided with a first inorganic coat layer composed of one or two kinds selected from copper oxide and copper suboxide, and the outer shell of the first inorganic coat layer is provided with a second inorganic matter coat layer composed of inorganic oxide consisting of one or more kinds selected from silicon oxide, aluminum oxide, magnesium oxide, zirconium oxide, titanium oxide and zinc oxide.

COPYRIGHT: (C)2005,JPO&NCIPI


Inventors:
Takahiko Sakagami
Katsuhiko Yoshimaru
Application Number:
JP2003397185A
Publication Date:
December 17, 2008
Filing Date:
November 27, 2003
Export Citation:
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Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
B22F1/02; B23K35/22; B22F1/00; H01B1/22; H01B5/00
Domestic Patent References:
JP2000345201A
JP2002146401A
JP2001040401A
JP2002356702A
JP2001240901A
Attorney, Agent or Firm:
Katsuhiro Yoshimura