Title:
加熱焼結性銀粒子の製造方法、ペースト状銀粒子組成物、固形状銀の製造方法、金属製部材の接合方法、プリント配線板の製造方法および電気回路接続用バンプの製造方法
Document Type and Number:
Japanese Patent JP5425962
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a heat-sinterable silver particle that, when heated, becomes a solid silver excellent in adhesion strength, hardness, electrical conductivity and thermal conductivity through sintering of the silver particle at a relatively low temperature, a paste-like silver particle composition, a method for manufacturing the solid silver, a method for joining metal members, and the like.SOLUTION: A method for manufacturing a heat-sinterable silver particle comprises replacing a 5-24C monovalent fatty acid or a derivative thereof, which coats the surface of the silver particle, with a 2-4C polycarboxylic acid. A paste-like silver particle composition is a paste-like matter comprising the silver particle and a volatile dispersion medium having a dielectric constant of 20-80 and, when heated, becomes a solid silver through volatilization of the volatile dispersion medium and sintering of the silver particles with each other. A method for manufacturing the solid silver comprises heating the paste-like silver particle composition. The paste-like silver particle composition is used in a method for firmly joining metal members. A method for manufacturing a printed wiring board having silver wiring and a method for manufacturing an electric circuit connection bump are also provided.
Inventors:
Isshiki
Ryoko Masuda
Yasuhiro Kobayashi
Asami Hidetomo
Ryoko Masuda
Yasuhiro Kobayashi
Asami Hidetomo
Application Number:
JP2012085582A
Publication Date:
February 26, 2014
Filing Date:
April 04, 2012
Export Citation:
Assignee:
Nihon Handa Co., Ltd.
International Classes:
B22F1/02; B22F1/00; B22F7/04; B22F7/08; B22F9/00; H01B1/00; H01B1/22; H01B13/00; H05K3/12; H05K3/34
Domestic Patent References:
| JP2008095194A | ||||
| JP2006169613A | ||||
| JP2011038128A | ||||
| JP2011032509A |
Attorney, Agent or Firm:
Kubota Yoshitan