感光性樹脂組成物、ソルダーレジスト用組成物、プリント配線板、及び感光性樹脂組成物の製造方法

Japanese Patent JP5878913

B2

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can be suitably used for formation of a solder resist layer and can suppress degradation of a cured film by light while using a resin prepared from an aromatic ring-containing epoxy resin as a matrix resin.SOLUTION: The photosensitive resin composition comprises at least one of the following components A1 and A2, and the following components B2, C and D. The components are: (A1) a photosensitive resin having at least two ethylenically unsaturated groups in one molecule, which is obtained from a hydrogenated epoxy resin that is obtained by hydrogenating an aromatic ring-containing epoxy resin; (A2) a photosensitive resin having at least two ethylenically unsaturated groups in one molecule, which is obtained from an epoxy resin having no aromatic ring; (B2) a hydrogenated epoxy resin epoxy compound having at least two epoxy groups in one molecule, which is obtained by hydrogenating an aromatic ring-containing epoxy resin; (C) a photopolymerization initiator; and (D) a diluent.

Wataru Hamada

JP2013260155A

March 08, 2016

December 17, 2013

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Mutual Chemical Industry Co., Ltd.

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Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki
Kyohei Tokioka
Yutaka Kimura

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