Title:
使用済み電子回路基板のリサイクル方法およびそのリサイクル方法を実施するためのシステム
Document Type and Number:
Japanese Patent JP6785243
Kind Code:
B2
Abstract:
The invention relates to the field of hydrometallurgy. The use thereof for recovering precious metals from electronic circuit boards of modern microelectronics, for example, from computer printed circuit boards, allows to increase the rate of recovering metals from spent printed circuit boards while enabling the recycling thereof during a continuous process. The method is carried out in the system comprising: a first hammer grinder designed for executing a mechanical removal of hang-on parts from the electronic circuit boards and for obtaining a first intermediary product composed of crushed hang-on parts and lightweight circuit boards with mounting and micro-mounting parts; a first trommel designed for separating the lightweight circuit boards from the first intermediary product; an activator designed for dissolving chemically, using a solvent, a solder from the lightweight circuit boards and freeing thereof from the mounting and micro-mounting parts, and for obtaining a suspension of dissolved solder and a solid phase composed of the mounting and micro-mounting parts forming a sludge, and of plastic bases of the circuit boards; a second trommel designed for extracting the suspension of dissolved solder from the solid phase and plastic bases of the circuit boards and for segregating the solid phase and the sludge into the plastic bases of the circuit boards and at least two groups of members having various dimensions, a lesser members including mainly aurum, platinum, and palladium, and greater members including mainly argentum and aurum.
Inventors:
Butihin, Evgeny Petrovich
Sisoev, Yuri Mitrofarnovich
Elisov, Alexander Guenna Dievich
Boccariova, Valery Mikhailovich
Sisoev, Yuri Mitrofarnovich
Elisov, Alexander Guenna Dievich
Boccariova, Valery Mikhailovich
Application Number:
JP2017551988A
Publication Date:
November 18, 2020
Filing Date:
December 17, 2015
Export Citation:
Assignee:
Botikalyova, Zegna Ivanovna
Butihin, Evgeny Petrovich
Sisoev, Yuri Mitrofarnovich
Elisov, Alexander Guenna Dievich
Butihin, Evgeny Petrovich
Sisoev, Yuri Mitrofarnovich
Elisov, Alexander Guenna Dievich
International Classes:
C22B7/00; B01D50/00; B03B5/00; B03B7/00; B03B9/06; B03C1/00; B03C1/02; B03C1/24; B07B1/00; B07B1/22; B07B7/02; B09B3/00; B09B5/00; C22B1/00; C22B3/04; C22B3/44; C22B11/00; C22B13/00; C22B15/00; C22B21/00; C22B25/00
Domestic Patent References:
| JP2014529500A | ||||
| JP2003010706A | ||||
| JP2012131906A1 | ||||
| JP9324222A | ||||
| JP5502187A |
Foreign References:
| WO2003045564A1 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark