Title:
円筒形の被加工物から多数のウェハを同時にスライスするための方法
Document Type and Number:
Japanese Patent JP5649692
Kind Code:
B2
Abstract:
A method for simultaneously slicing a multiplicity of wafers from a substantially circular-cylindrical workpiece that is connected to a sawing strip includes executing a relative movement between the workpiece and a wire gang of a wire saw with the aid of a forward feed device with a defined forward feed rate so as to slice the wafers. The forward feed rate is varied through the course of the method and includes being set to a value v1 at a cutting depth of 50% of the workpiece diameter. Subsequently, the forward feed rate is to a value v2>1.15×v1 as the forward feed rate passes through a local maximum. The forward feed rate is set to a value v3v3.
Inventors:
アルベルト・ブランク
Application Number:
JP2013124510A
Publication Date:
January 07, 2015
Filing Date:
June 13, 2013
Export Citation:
Assignee:
ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ
International Classes:
H01L21/304; B24B27/06; B28D5/04
Attorney, Agent or Firm:
Patent business corporation Fukami patent firm