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Title:
調整レーザパルスを動的に生成する方法およびシステム
Document Type and Number:
Japanese Patent JP5766111
Kind Code:
B2
Abstract:
Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. The temporal pulse profile includes a first portion that defines a first time duration, and a second portion that defines a second time duration. A method includes generating a laser pulse based on laser system input parameters configured to shape the laser pulse according to the temporal pulse profile, detecting the generated laser pulse, comparing the generated laser pulse to the temporal pulse profile, and adjusting the laser system input parameters based on the comparison.

Inventors:
Baird, Bryan, W.
Bander Giessen, Clint, Earl.
Steve Swallowingen
Robert Heinsey
Sun, Yun Long
Bullland, Kelly, Jay.
Hooper, Andrew
Application Number:
JP2011501972A
Publication Date:
August 19, 2015
Filing Date:
March 24, 2009
Export Citation:
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Assignee:
Electro Scientific Industries, Inc.
International Classes:
B23K26/00; B23K26/064; B23K26/073; H01S3/00
Domestic Patent References:
JP2007503125A
JP2000286495A
JP11243245A
Attorney, Agent or Firm:
Yusuke Hiraki
Sekiya Mitsuo
Toshiaki Watanabe
Hidekazu Matsumaru
Akira Yoshikawa



 
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