Title:
混成回路基板上に装着可能な超小型電気機械要素
Document Type and Number:
Japanese Patent JP4330190
Kind Code:
B2
Abstract:
A micro-electromechanical component (10) which includes a micro-system in a chip made by deposit, photolithography and micro-manufacturing of successive layers. The micro-system comprises a plurality of contact pads for electrical connection (16). The chip is provided with a localized external coating (20) to allow its transfer onto a substrate (28). This coating has on its surface a plurality of external metallizations (22) connected electrically through the coating material to the underlying contact pads of the chip. The coated component has approximately the same length and width as those of the chip before coating. The coating is formed only in a localized region on a reduced portion of the chip, essentially in the region of the pads and the metallizations, the sensing part of the micro-system not so coated and thus protected from mechanical constraints caused due to the application and hardening of the coating material.
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Inventors:
Thierry Regai
Dominique gilet
Eve Van Campanute
Dominique gilet
Eve Van Campanute
Application Number:
JP33168598A
Publication Date:
September 16, 2009
Filing Date:
November 20, 1998
Export Citation:
Assignee:
ER A Medical Society Anonym
International Classes:
A61M5/20; H01L25/00; B62D57/00; B81C3/00; H01L23/31; H05K3/34; H01L29/06
Domestic Patent References:
JP8316497A | ||||
JP9055394A | ||||
JP7508615A |
Attorney, Agent or Firm:
Haruo Hamada