Title:
マイクロ波集積回路
Document Type and Number:
Japanese Patent JP7222276
Kind Code:
B2
Abstract:
To provide a microwave integrated circuit which effectively reduces an oscillation in an output signal.SOLUTION: A microwave integrated circuit includes: a semiconductor substrate 3; a plurality of amplification units formed in the semiconductor substrate 3; an electric wiring W3 that is formed in one electric wiring layer excluding the electric wiring layer of a top layer and the electric wiring layer of a bottom layer from a plurality of electric wiring layers formed on the semiconductor substrate 3, and supplies a power source to a plurality of amplification units; a plurality of conductive regions 51 formed while nipping the electric wiring W3 in the electric wiring layer; a plurality of vias 21a that connect an another conductive region 53 formed in a region that nips the electric wiring W3 in the two electric wiring layers just above and just under the electric wiring layer with a WG. Each of the plurality of vias 21a forms a via structure connected by a plurality of other vias 21b and 21d in conductive regions 55 and 59 of the electric wiring layer of the bottom layer.SELECTED DRAWING: Figure 6
Inventors:
Kenji Naito
Application Number:
JP2019045545A
Publication Date:
February 15, 2023
Filing Date:
March 13, 2019
Export Citation:
Assignee:
Sumitomo Electric Device Innovation Co., Ltd.
International Classes:
H01L21/822; H01L21/768; H01L21/82; H01L23/522; H01L27/04
Domestic Patent References:
| JP2004259722A | ||||
| JP2008244382A | ||||
| JP2244488A | ||||
| JP2007329168A | ||||
| JP2008021789A |
Foreign References:
| US20040207432 | ||||
| US20080237736 | ||||
| WO2007083668A1 | ||||
| EP1976133A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
▲高▼木 邦夫
Yuji Suwazawa
Yoshiki Kuroki
▲高▼木 邦夫
Yuji Suwazawa
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