Title:
A mixed making process of a high precision metal mask
Document Type and Number:
Japanese Patent JP5969114
Kind Code:
B2
Abstract:
A fabricating technique for a high precision metal mask plate comprises: fabricating a substrate with a certain thickness by electroforming a nickel alloy, the substrate having an opening, that is, a through-hole; and etching a recess with a certain depth on a face of a mask substrate through an etching technique, so as to enable an opening size of the etched face to be greater than an opening size of an unetched face, and enable a hole wall to be a fillet to form a taper. The metal mask plate fabricated by applying a mixed technique of electroforming plus etching has advantages of low cost, good perforation quality, and high perforation precision, so as to reduce the thickness of a valid model, and improve an evaporation coating filming ratio during an evaporation coating process of the mask plate.
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Inventors:
Wei Shiling
Takakodaira
Takakodaira
Application Number:
JP2015510623A
Publication Date:
August 10, 2016
Filing Date:
May 07, 2013
Export Citation:
Assignee:
Kunshan Yishin Photonic Technology Co., Ltd.
International Classes:
C23C14/04; H01L51/50; H05B33/10
Domestic Patent References:
| JP2005314787A | ||||
| JP2007280774A | ||||
| JP2006152396A |
Attorney, Agent or Firm:
Kazuyuki Hirayama
Yoshinori Morita
Yoshinori Morita