Title:
MOLD DIE, RESIN MOLDING DEVICE AND RESIN MOLDING METHOD
Document Type and Number:
Japanese Patent JP2017007170
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a mold die capable of performing resin molding to a workpiece having an exposed member from a resin package, without resin leakage and breakage.SOLUTION: When a workpiece 1 is clamped with a pair of dies, a terminal pin 2c is inserted into an insertion hole 5f and an elastic member 6 surrounding the terminal pin 2c is crushed by a movable pressing member 7, deformation of the elastic member 6 to outside, is regulated by a storage case 5c, then resin molding is performed in a manner in which the elastic member is deformed so as to fill a gap between the terminal pin 2c and the insertion hole 5f.SELECTED DRAWING: Figure 3
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Inventors:
IKEDA MASANOBU
SATO HISASHI
SATO HISASHI
Application Number:
JP2015123501A
Publication Date:
January 12, 2017
Filing Date:
June 19, 2015
Export Citation:
Assignee:
APIC YAMADA CORP
International Classes:
B29C33/12; B29C45/14; H01L21/56
Attorney, Agent or Firm:
Watanuki International Patent and Trademark Office