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Title:
Mold disassembling method and equipment
Document Type and Number:
Japanese Patent JP6350244
Kind Code:
B2
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Inventors:
Yasushi Ohno
Application Number:
JP2014240876A
Publication Date:
July 04, 2018
Filing Date:
November 28, 2014
Export Citation:
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Assignee:
Shinto Industry Co., Ltd.
International Classes:
B22D46/00; B22D29/00; B22D29/04
Domestic Patent References:
JP11347710A
JP2012045595A
JP56160866A
JP2013215789A
Attorney, Agent or Firm:
Patent Business Corporation Najima Patent Office



 
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