Title:
MOLDING COMPONENT
Document Type and Number:
Japanese Patent JP2023175139
Kind Code:
A
Abstract:
To provide a molding component for facilitating a soldering work and also preventing a contact between adjacent soldering parts.SOLUTION: A molding component 1 includes an inner component module 2 having a first molding part 40, soldering parts 60, and a second molding part 50. Lead wires include first lead wires 12, 13 and second lead wires 22, 23. The first molding part 40 includes a partition part 43 having a first surface I and a second surface II. The first lead wires 12, 13 include first exposure parts 12a, 13a on the first surface I, and the second lead wires 22, 23 include second exposure parts 22a, 23a on the second surface II. The first lead wires 12, 13 and the second lead wires 22, 23 are positioned without overlapping in a plane view from a direction of the first surface I or a direction of the second surface II. The soldering parts 60 include: first soldering parts 61 positioned on the first surface I; and second soldering parts 62 positioned on the second surface II.SELECTED DRAWING: Figure 5
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Inventors:
WEI LIN
KOYANO HIROYUKI
TERASAKA MOTOJU
KOBAYASHI TOSHINARI
YAMAO MOE
KOYANO HIROYUKI
TERASAKA MOTOJU
KOBAYASHI TOSHINARI
YAMAO MOE
Application Number:
JP2022087440A
Publication Date:
December 12, 2023
Filing Date:
May 30, 2022
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS
International Classes:
G01P1/02
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Akio Takeshita
Tomohiro Fukuichi
Takahiro Arita
Akio Takeshita
Tomohiro Fukuichi