Title:
型を用いて基板上の組成物を成形する成形装置及び物品の製造方法
Document Type and Number:
Japanese Patent JP6995530
Kind Code:
B2
Abstract:
To reduce defects on a substrate while reducing force applied when a mold and the substrate are separated from each other.SOLUTION: A molding apparatus for molding a composition on a substrate using a mold includes a first drive unit that moves at least one of a mold holding portion and a substrate holding portion in a first direction for separating the mold and the composition in a first direction after bringing the mold and the composition into contact and molding the composition and a second drive unit that move at least one of the mold holding portion and the substrate holding portion in a direction perpendicular to the first direction, and the second drive unit performs the movement in the second direction perpendicular to the first direction and the movement in a third direction perpendicular to the first direction and intersecting the second direction when the mold and the composition are separated.SELECTED DRAWING: Figure 2
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Inventors:
Yoshida Setsuo
Application Number:
JP2017164417A
Publication Date:
January 14, 2022
Filing Date:
August 29, 2017
Export Citation:
Assignee:
Canon Inc
International Classes:
H01L21/027; B29C59/02
Domestic Patent References:
| JP2007266053A | ||||
| JP2008529826A | ||||
| JP2017112230A | ||||
| JP2011100952A | ||||
| JP2016219679A |
Attorney, Agent or Firm:
Takuma Abe
Sougo Kuroiwa
Sougo Kuroiwa