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Patent Searching and Data


Title:
METHOD FOR PUNCHING WIRING PATTERN
Document Type and Number:
Japanese Patent JPH0676660
Kind Code:
A
Abstract:

PURPOSE: To accurately and surely punch a wiring pattern of accurate form through conductor foil by using two intersecting pairs of punching blades.

CONSTITUTION: An adhesive layer 4 is formed, using an adhesive-layer forming machine, in a wiring-pattern forming portion on one side 2a of a carrier tape 2 fed from a drum and then a masking portion 6 made by silicone resin coating is formed over the adhesive layer 4 using a resin coating machine provided downstream of the adhesive-layer forming machine, and the surface of the adhesive layer 4 is exposed from a portion 8 of the tape 2 corresponding to a wiring pattern, so as to form a non-masking portion 10. Next conductor foil 7 is drawn from another drum, bonded to the carrier tape 2 and is fed to a half cutter, and lines 44, 44 are punched therethrough using a pair of first opposite punching blades and then lines 45, 45 are punched therethrough using second punching blades crossing the first punching blades, and each of the conductors of the wiring pattern are exactly and accureately punched and thus the wiring pattern is punched through conductor foil 7.


Inventors:
NAKAGAWA CHIHIRO
TANNO SHOGO
TAKAGI TOSHIYUKI
Application Number:
JP25079192A
Publication Date:
March 18, 1994
Filing Date:
August 25, 1992
Export Citation:
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Assignee:
MITSUBISHI CABLE IND LTD
International Classes:
B21D28/02; H01B13/00; H05K3/04; H05K3/38; (IPC1-7): H01B13/00
Attorney, Agent or Firm:
Takeshi Nakatani