Title:
モータ制御装置
Document Type and Number:
Japanese Patent JP7131103
Kind Code:
B2
Abstract:
To prevent an adhesive from protruding to a connection portion side with a winding of a motor while increasing an adhesive area to a connector for connecting a drive board and the winding of the motor when the connector is adhesively fixed to a housing.SOLUTION: In an internal connector 34, a space for an adhesive 42 is provided by forming a through hole 43 using a hole 39. This makes it possible to absorb the variation in the application of the adhesive 42, thereby reducing the defect rate due to the protrusion of the adhesive 42 and the number of repairing steps. As a result, it is possible to prevent the protruding adhesive 42 from coming into contact with the tip of a terminal 35, and prevent an electrode for heat swaging from being interfered by the adhesive 42.SELECTED DRAWING: Figure 1
Inventors:
Yoshifumi Nakamura
Application Number:
JP2018111081A
Publication Date:
September 06, 2022
Filing Date:
June 11, 2018
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H02K5/22; H02K11/33
Domestic Patent References:
| JP2018007419A | ||||
| JP2005057892A | ||||
| JP2013223312A | ||||
| JP2005133788A | ||||
| JP2015180157A | ||||
| JP2018019494A | ||||
| JP2017003506A | ||||
| JP2016109172A | ||||
| JP2017009506A |
Attorney, Agent or Firm:
Patent Attorney Corporation Sato
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