Title:
MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP2023171669
Kind Code:
A
Abstract:
To provide a mounting device capable of accurately stabilizing a temperature while shortening an aging operation.SOLUTION: For an aging operation prior to a main mounting operation for mounting an electric component 100 onto a tape 300, a bonding head 2 and a bonding stage 3 are moved to an out-of-tape position 92 that is deviated from the tape 300. Then, the bonding head 2 and the bonding stage 3 are relatively contacted or approached at the out-of-tape position 92 while being heated by a head side heater 21, a stage side heater 31 and the like until a temperature is stabilized.SELECTED DRAWING: Figure 9
More Like This:
Inventors:
HARA TOMOYUKI
Application Number:
JP2023177914A
Publication Date:
December 01, 2023
Filing Date:
October 13, 2023
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP
International Classes:
H01L21/60