Title:
MOUNTING STRUCTURE AND BGA BALL
Document Type and Number:
Japanese Patent JP2016111072
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a BGA ball and a mounting structure that can secure high connection reliability even when repetitively exposed to high temperature of 150°C at maximum like the inside of a vehicle engine room.SOLUTION: BGA 8 having a BGA electrode 3, a circuit board 4 having a circuit board electrode 6, and a soldering joint portion 15 which is disposed on the circuit board electrode 6 and connected to the BGA electrode are provided. The soldering joint portion contains Cu ranging from not less than 0.6 mass% to not more than 1.2 mass% in percentage content, Ag ranging from not less than 3.0 mass% to not more than 4.0 mass% in percentage content, Bi ranging from not less than 0 mass% to not more than 1.0 mass% and In whose percentage content varies relatively to the percentage content of Cu, and the remainder is formed of Sn.SELECTED DRAWING: Figure 1(a)
Inventors:
HINE KIYOHIRO
FURUSAWA AKIO
MORI MASAHITO
NAKAMURA TAICHI
KITAURA HIDETOSHI
FURUSAWA AKIO
MORI MASAHITO
NAKAMURA TAICHI
KITAURA HIDETOSHI
Application Number:
JP2014244619A
Publication Date:
June 20, 2016
Filing Date:
December 03, 2014
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H01L23/12; B23K35/26; C22C13/00; H01L21/60; H05K3/34
Domestic Patent References:
| JP2007013099A | 2007-01-18 |
Foreign References:
| WO2010122764A1 | 2010-10-28 | |||
| WO2009011392A1 | 2009-01-22 |
Attorney, Agent or Firm:
Kentaro Fujii
Kenji Kamada
Hiroo Maeda
Kenji Kamada
Hiroo Maeda
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