Title:
多層配線基板及びその製造方法
Document Type and Number:
Japanese Patent JP5170227
Kind Code:
B2
Inventors:
Ikumo Masamitsu
Kazuhiro Okamoto
Eiji Watanabe
Kazuhiro Okamoto
Eiji Watanabe
Application Number:
JP2010276000A
Publication Date:
March 27, 2013
Filing Date:
December 10, 2010
Export Citation:
Assignee:
Fujitsu Semiconductor Limited
International Classes:
H05K3/46; H05K1/02; H05K3/00
Domestic Patent References:
JP2004319607A | ||||
JP10135157A | ||||
JP918150A | ||||
JP10322027A | ||||
JP200264271A | ||||
JP2000151102A | ||||
JP2003209357A | ||||
JP2001102753A |
Attorney, Agent or Firm:
Tadahiko Ito
Akinori Yamaguchi
Akinori Yamaguchi