Title:
VACUUM PROCESSING APPARATUS AND OPERATING METHOD OF VACUUM PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2017128796
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a technique for suppressing particles from sticking on a wafer when a gate valve partitioning off a vacuum transfer module and a vacuum processing module is opened/closed.SOLUTION: For transferring a wafer W between a vacuum transfer chamber 2 and a processing vessel 30, an Ar gas is supplied from above a mounting table 5 in the processing vessel 30 before a gate valve 40 partitioning off both is opened so that the inert gas has a smaller flow rate than an Ngas supplied into the vacuum transfer chamber 2 and the pressure in the processing vessel 30 is lower than the pressure in the vacuum transfer chamber 2. Consequently, when the gate valve 40 is opened, the Ngas flows from the vacuum transfer chamber 2 to flow in the processing vessel 30 and then flows from a center portion toward a peripheral part of a top surface of the mounting table 5, and then the gate valve 40 is opened while an air current flowing downward from the peripheral edge of the mounting table 5 is maintained so as to transfer the wafer W, thereby suppressing sticking matter 100 from scattering to above the mounting table 5.SELECTED DRAWING: Figure 4
Inventors:
YAMASAKI HIDEAKI
OKABE SHINYA
ITATANI TAKESHI
OKABE SHINYA
ITATANI TAKESHI
Application Number:
JP2016235361A
Publication Date:
July 27, 2017
Filing Date:
December 02, 2016
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
C23C16/52; H01L21/02; H01L21/3065; H01L21/677
Domestic Patent References:
| JP2005019960A | 2005-01-20 | |||
| JP2005527120A | 2005-09-08 |
Attorney, Agent or Firm:
Toshio Inoue
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