Title:
An optical module, a light scanning apparatus, an image forming device, and a manufacturing method of an optical module
Document Type and Number:
Japanese Patent JP6218106
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an optical module that can prevent, when a package body and a support are welded to each other, damage to joining materials to prevent the occurrence of sealing defects.SOLUTION: An light source device 400 includes a package 10 on which a surface light emitting laser array chip 40 and a photodiode 60 are mounted, a support that includes a lid 20 supporting, with joining materials therebetween, cover glass 41 transmitting at least a part of light, and a heat conduction member 70 that is brought into contact with both the package 10 and lid 20 when the package body and support are welded to each other. With this configuration, when the package body and support are welded to each other, damage to the joining materials can be prevented so as to prevent the occurrence of sealing defects.
Inventors:
Masaki Hiroi
Application Number:
JP2013135707A
Publication Date:
October 25, 2017
Filing Date:
June 28, 2013
Export Citation:
Assignee:
株式会社リコー
International Classes:
H01S5/022; B41J2/44; G02B26/10; H04N1/113
Domestic Patent References:
| JP63255984A | ||||
| JP2002270952A | ||||
| JP60257584A | ||||
| JP60088486A | ||||
| JP2011216852A | ||||
| JP8288581A | ||||
| JP2009220537A | ||||
| JP2004006824A | ||||
| JP2009212524A | ||||
| JP2012079827A |
Attorney, Agent or Firm:
Atsushi Tateishi
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