Title:
A package for element storage, and a mounting structure object provided with this
Document Type and Number:
Japanese Patent JP6046822
Kind Code:
B2
Abstract:
Provided is an element housing package that can suppress a deterioration in the connection reliability of a wiring base plate and a connector. An element housing package (3) of the present invention is provided with: a base plate (31) including, on a top surface (31a), a mounting region (31b) for mounting an element (2); a frame body (32) disposed on the top surface (31a) of the base plate (31) so as to surround the mounting region (31b), the frame body (32) including a through-hole (T); a connector (33) disposed so as to pass through the through-hole T of the frame body (32) and to extend from the inside to the outside of the frame body (32); a pedestal member (34) disposed on the top surface (31a) of the base plate (31) so as to be positioned in the frame body (32); and a wiring base plate (35) bonded to a top surface (34a) of the pedestal member (34) with a first bonding material (B1) placed therebetween and connected to the connector (33). In a longitudinal section along the through direction of the through-hole (T), a thickness of the frame body (32) along the through direction is greater than a thickness of the base plate (31). In the longitudinal section along the through direction of the through-holes (T), a width of the pedestal member (34) is greater than a height of the pedestal member (34). A side surface (34c) of the pedestal member (34) is bonded to an inner surface (32b) of the frame body (32) with a second bonding member (B2) placed therebetween, while a bottom surface (34b) of the pedestal member (34) is not bonded to the top surface (31a) of the base plate (31).
Inventors:
Takayuki Shirasaki
Application Number:
JP2015534250A
Publication Date:
December 21, 2016
Filing Date:
August 27, 2014
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/04; H01S5/022
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