Title:
A package for a manufacturing method and semiconductors and a semiconductor emission device of a package for semiconductors
Document Type and Number:
Japanese Patent JP5914933
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a package for a semiconductor which can minimize the yield loss of a package for semiconductor.SOLUTION: The manufacturing method of a package for a semiconductor includes a filling resin injection step for housing a pad 11 having a semiconductor element mounting surface 11a and a sidewall 11R standing on the side of the mounting surface 11a in a space between a first mold and a second mold facing the first mold, and injecting a filling resin into the space thus filling the mounting surface 11a of the pad 11 and a part of the sidewall 11R excepting the main surface 11Ra on the mounting surface side with the filling resin. In the filling resin injection step, the filling resin is injected into the space in a state where the first face of a protrusion is brought into tight contact with the mounting surface 11a, the second face of a protrusion is brought into tight contact with the main surface 11Ra of the sidewall 11R, and the third face of a protrusion is brought into tight contact with the side end face 11Rb of the sidewall 11R.
Inventors:
Yasuo Matsumi
Tatsuhiko Sakai
Tatsuhiko Sakai
Application Number:
JP2011280279A
Publication Date:
May 11, 2016
Filing Date:
December 21, 2011
Export Citation:
Assignee:
Sumitomo Chemical Co., Ltd.
International Classes:
H01L21/56; H01L33/48
Domestic Patent References:
| JP2010525569A |
Foreign References:
| US20120211789 |
Attorney, Agent or Firm:
Sumio Tanai
Akio Sato
Shingo Suzuki
Hiroyuki Kato
Naozumi Hiroyasu
Norihiko Ara
Mitsunaga Igarashi
Akio Sato
Shingo Suzuki
Hiroyuki Kato
Naozumi Hiroyasu
Norihiko Ara
Mitsunaga Igarashi