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Title:
A package of a semiconductor
Document Type and Number:
Japanese Patent JP6154094
Kind Code:
B2
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Inventors:
Tadashi Kokubo
Katsuya Ouchi
Takanao Iwahara
Application Number:
JP2010085899A
Publication Date:
June 28, 2017
Filing Date:
April 02, 2010
Export Citation:
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Assignee:
Kaneka Corporation
International Classes:
C08L101/02; H01L23/08
Domestic Patent References:
JP2005136379A
JP2005146191A
JP2009275206A
Attorney, Agent or Firm:
Atomi International Patent Office



 
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