Title:
成形用包装材
Document Type and Number:
Japanese Patent JP5745132
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a packaging material for molding with excellent moldability, causing no pinholes or cracks even in deep drawing or stretch forming with a large forming height.SOLUTION: A packaging material 1 for molding includes a heat-resistant resin layer 2 as outer layer, a thermoplastic resin layer 3 as inner layer, and a metal foil layer 4 disposed between both of the layers. A biaxially drawn polypropylene film layer 5 is laminated between the thermoplastic resin layer 3 and the metal foil layer 4. At least a thermoplastic resin layer-side surface of the biaxially drawn polypropylene film layer 5 is coated with a resin layer 20 having a melting point equal to or lower than the melting point of the thermoplastic resin layer 3.
Inventors:
Tetsunobu Kuramoto
Yuji Minamibori
Yuji Minamibori
Application Number:
JP2014087072A
Publication Date:
July 08, 2015
Filing Date:
April 21, 2014
Export Citation:
Assignee:
Showa Denko Packaging Co., Ltd.
International Classes:
B32B15/085; B65D1/00; B65D65/40; H01M2/02
Domestic Patent References:
JP2004327042A | ||||
JP2002234123A | ||||
JP2002216714A | ||||
JP2005103955A |
Attorney, Agent or Firm:
Yoshihito Shimizu
Hisayoshi Shimizu
Hisayoshi Shimizu
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