Title:
パッケージング構造
Document Type and Number:
Japanese Patent JP7431292
Kind Code:
B2
Abstract:
An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure ofwherein X is —O—,and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.
Inventors:
So Kisuke
鄭昭▲徳▼
Thank you
Zhou Jinghui
鄭昭▲徳▼
Thank you
Zhou Jinghui
Application Number:
JP2022131137A
Publication Date:
February 14, 2024
Filing Date:
August 19, 2022
Export Citation:
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
International Classes:
G02F1/1333; C07D209/48; C08F20/36; C08F299/02; C08G59/14; C08G59/42
Domestic Patent References:
| JP61012721A | ||||
| JP2020204014A | ||||
| JP60077652A | ||||
| JP55104345A | ||||
| JP2020186208A |
Foreign References:
| WO2021117686A1 |
Attorney, Agent or Firm:
Maeda Suzuki International Patent Attorneys Corporation