To provide a novel coated structure for an electronic apparatus member with a characteristic to lower the internal temperature of the electronic apparatus member (heat dissipation property), while satisfying intrinsic characteristics required by the electronic apparatus member (ensurance of airtightness accompanying waterproofing, dustproofing or the like, miniaturization, and making light weight).

The coated structure for an electronic apparatus member is adapted such that on the front and rear surfaces of a substrate a film of ≥0.3 μm thickness is coated, and at least the rear surface is coated with a heat dissipation film featuring a heat dissipation property. Meanwhile, the heat dissipation coated film is either a black coated film including a black additive or heat dissipation coated film including other heat dissipation additive than the black additive. In the integral emissivity of infrared rays (wavelength : 4.5 to 15.4 μm) when the coated structure is heated up to 100 °C, the integral emissivity of infrared rays of the coated structure in the case of coated film on the front surface and the integrated emissivity of infrared rays of the coated structure in the case of film coating on the rear surface are specified.

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