ブイのパラシュートハウジング構造およびパラシュートハウジングの分離方法

Title:

ブイのパラシュートハウジング構造およびパラシュートハウジングの分離方法

Document Type and Number:

Japanese Patent JP4299594

Kind Code:

B2

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Inventors:

Maeda Yukiya

Application Number:

JP2003174439A

Publication Date:

July 22, 2009

Filing Date:

June 19, 2003

Export Citation:

Assignee:

NEC Network and Sensor Systems Co., Ltd.

International Classes:

B63B22/00; B63C11/48

Domestic Patent References:

Attorney, Agent or Firm:

Masahiko Desk
Akitaka Kimura
Yasuhisa Tanizawa

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