Title:
A pattern formation method, the temperature control method of the member in a treatment container, and a substrate treatment system
Document Type and Number:
Japanese Patent JP6085079
Kind Code:
B2
Abstract:
A pattern forming system includes: a forming device configured to form a pattern by etching a film on a substrate in a processing vessel; a member in the processing vessel that is positioned in the processing vessel to increase uniformity of the pattern in a surface of the substrate; a measurement apparatus configured to measure a shape or a critical dimension of the pattern; a control device configured to control a temperature of the member in the processing vessel; a processing gas supply unit configured to introduce a processing gas to the processing vessel; and an exhaust device configured to depressurize an inside of the processing vessel to a certain pressure level. The control device is configured to control the temperature of the member in the processing vessel based on the measured shape or the measured critical dimension of the pattern through a feedback control.
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Inventors:
Kazuo Sawai
Keisuke Tanaka
Hisashi Nagahata
Keisuke Tanaka
Hisashi Nagahata
Application Number:
JP2011070947A
Publication Date:
February 22, 2017
Filing Date:
March 28, 2011
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065
Domestic Patent References:
| JP2006216822A | ||||
| JP2008270542A | ||||
| JP2010272758A | ||||
| JP20119351A |
Attorney, Agent or Firm:
Hideno Kono
Nobuo Kono
Nobuo Kono
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