Title:
光反応性樹脂組成物、回路基板の製造方法、およびセラミック多層基板の製造方法
Document Type and Number:
Japanese Patent JP3975932
Kind Code:
B2
Abstract:
A photoreactive resin composition contains (a) a powdered base metal, (b) an organic binder, (c) a photosensitive organic component, and (d) a polycarboxylic acid-based dispersing agent with a molecular weight of about 1,500 or less. Also disclosed is a method for making a circuit substrate or a ceramic multilayer substrate including the step of forming a conductive pattern using the photoreactive resin composition.
Inventors:
Masahiro Kubota
Application Number:
JP2003033856A
Publication Date:
September 12, 2007
Filing Date:
February 12, 2003
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
C08F2/44; G03F7/004; C08F290/12; G03F7/033; G03F7/40; H01B1/22; H05K1/09; H05K3/02; H05K3/46
Domestic Patent References:
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| JP2003140330A | ||||
| JP2000003047A | ||||
| JP2001106712A | ||||
| JP7268065A | ||||
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