Title:
A photosensitive adhesive composition, a photosensitive adhesives film, and a semiconductor device using these
Document Type and Number:
Japanese Patent JP5935323
Kind Code:
B2
Abstract:
Provided is a photosensitive adhesive composition comprising (A) an alkali-soluble polyimide having particular structural unit(s) and having a particular structure at at least one end of the main chain, (B) a glycidylamine type epoxy compound of a particular structure, (C) a photopolymerizable compound, and (D) a photoinitiator, wherein (A) the alkali-soluble polyimide has a glass transition temperature of 160°C or higher. The photosensitive adhesive composition of the present invention has the ability to form patterns with an alkaline developer, excellent thermocompressibility at a low temperature to an irregular substrate after exposure, and a high adhesive strength even at a high temperature.
Inventors:
Kazuyuki Matsumura
Sugimoto Kanako
Hiroyuki Niou
Riki Inagaki
Sugimoto Kanako
Hiroyuki Niou
Riki Inagaki
Application Number:
JP2011530184A
Publication Date:
June 15, 2016
Filing Date:
June 10, 2011
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C09J179/08; C09J4/00; C09J7/00; C09J11/06; C09J163/00; G03F7/037; H01L21/52
Domestic Patent References:
| JP2008115241A | 2008-05-22 | |||
| JP2009227959A | 2009-10-08 | |||
| JP2009068002A | 2009-04-02 | |||
| JP2009068002A | 2009-04-02 | |||
| JP2008115241A | 2008-05-22 | |||
| JP2009227959A | 2009-10-08 |
Foreign References:
| WO2008084843A1 | 2008-07-17 | |||
| WO2008149625A1 | 2008-12-11 | |||
| WO2007004569A1 | 2007-01-11 | |||
| WO2010024087A1 | 2010-03-04 | |||
| WO2010024087A1 | 2010-03-04 | |||
| WO2008084843A1 | 2008-07-17 | |||
| WO2008149625A1 | 2008-12-11 | |||
| WO2007004569A1 | 2007-01-11 |
Other References:
JPN6015021055; 接着ハンドブック 第３版, 19960628, 第４１５-４３４頁, 日刊工業新聞社
JPN6015021055; 接着ハンドブック 第３版, 19960628, 第４１５-４３４頁, 日刊工業新聞社
JPN6015021055; 接着ハンドブック 第３版, 19960628, 第４１５-４３４頁, 日刊工業新聞社