Title:
感光性樹脂組成物これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
Document Type and Number:
Japanese Patent JP4586067
Kind Code:
B2
Abstract:
The photosensitive resin composition of the present invention is a photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound with at least one polymerizable ethylenic unsaturated group in the molecule; and (C) a photopolymerization initiator, wherein component (A) contains a polymer that contains a compound represented by the following general formula (I) as a polymerization component: CH2═C(L1)-COOL2 (I) (wherein L1 represents a hydrogen atom or methyl group and L2 represents a C2-20 alkyl group group) and component (B) contains a compound represented by the following general formula (II): (wherein R1 represents a hydrogen atom or methyl group, R2 represents a C3-20 alkyl group that has at least 2 tertiary or higher carbon atoms, X represents a C2-6 alkylene group, and n is an integer from 1 to 20).
Inventors:
Yoshiki Amioka
Tachiya Ichikawa
Mitsuo Matsuda
Takahiro Inazuki
Tachiya Ichikawa
Mitsuo Matsuda
Takahiro Inazuki
Application Number:
JP2007518893A
Publication Date:
November 24, 2010
Filing Date:
May 15, 2006
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
Rhodia Nika Co., Ltd.
Rhodia Nika Co., Ltd.
International Classes:
G03F7/033; C08F2/44; C08F2/50; G03F7/004; G03F7/027; H05K3/06; H05K3/18
Domestic Patent References:
| JPH04195050A | 1992-07-15 | |||
| JPH01271469A | 1989-10-30 | |||
| JP2000314957A | 2000-11-14 | |||
| JP2004184878A | 2004-07-02 | |||
| JP2001154347A | 2001-06-08 | |||
| JP2002182381A | 2002-06-26 | |||
| JP2004280021A | 2004-10-07 | |||
| JP2006154666A | 2006-06-15 | |||
| JP2000314958A | 2000-11-14 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Yoshinori Shimizu