Title:
A photosensitive resin composition, a photographic sensitive film, a pattern formation method, the formation method of a hollow structured, and electronic parts
Document Type and Number:
Japanese Patent JP6136095
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that has excellent heat and moisture resistance, has a high elasticity in a cured product at high temperature, and also has excellent hollow-structure maintainability, and a photosensitive film, a pattern forming method, a forming method for hollow structure, and an electronic component using the same.SOLUTION: A photosensitive resin composition comprises (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) a photopolymerizable initiator, and contains an oxime ester compound and/or an acylphosphine oxide compound as (B) the photopolymerizable initiator.
Inventors:
Kato Sadaaki
Shinjiro Fujii
Shinjiro Fujii
Application Number:
JP2012074808A
Publication Date:
May 31, 2017
Filing Date:
March 28, 2012
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
G03F7/031; C08F2/50; C08F20/36; C08F290/06; G03F7/004; G03F7/027; G03F7/029; H03H9/25
Domestic Patent References:
| JP2011043806A | ||||
| JP2001040022A | ||||
| JP2010145522A | ||||
| JP2010020107A | ||||
| JP2010266814A | ||||
| JP2009198710A | ||||
| JP2009265389A | ||||
| JP2010077389A | ||||
| JP2009007567A | ||||
| JP8339084A |
Foreign References:
| WO2011001942A1 | ||||
| WO2007077691A1 | ||||
| US20040135292 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kenichi Hirasawa