Title:
A photosensitive resin composition and a pressure sensitive adhensive sheet
Document Type and Number:
Japanese Patent JP5974446
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a sufficient storage stability and capable of enabling hardening in a short time even with a low heating temperature, and a tacky adhesive sheet.SOLUTION: The photosensitive resin composition includes a base generator for generating a base by electromagnetic wave irradiation or by heating after electromagnetic wave irradiation, a curable compound having at least two or more epoxy groups in a molecule, and a compound having a mercapto group in the molecule. The base generator is represented by formula (I) (wherein Rand Rare each independently a hydrocarbon group, which may include a hydrogen or a substituent, or an unsaturated bond, and they may be the same or different).
Inventors:
Takahisa Taniguchi
Amano Hiroko
Asami Motooka
Katsuya Sakayori
Amano Hiroko
Asami Motooka
Katsuya Sakayori
Application Number:
JP2011226789A
Publication Date:
August 23, 2016
Filing Date:
October 14, 2011
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
C09J7/00; C08G59/66; C09J11/06; C09J163/00
Domestic Patent References:
| JP2007077382A | ||||
| JP2009080452A | ||||
| JP2011089102A | ||||
| JP2011089119A | ||||
| JP2011068888A | ||||
| JP2011052214A | ||||
| JP2010254982A | ||||
| JP2010106233A |
Foreign References:
| WO2010113813A1 |
Attorney, Agent or Firm:
Masayuki Masabayashi
Tetsuo Shiba
Hayashi Ichiyoshi
Hisao Kamada
Tetsuo Shiba
Hayashi Ichiyoshi
Hisao Kamada
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