Title:
ELEMENT MOUNTING MEMBER, PIEZOELECTRIC DEVICE INCLUDING THE SAME, AND ADHESIVE APPLICATION METHOD
Document Type and Number:
Japanese Patent JP2018067862
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an element mounting member 10 and the like that can suppress a conductive adhesive 41 applied to an electrode pad 40 from flowing into the inside of a piezoelectric vibrating element 70 even if a space between the piezoelectric vibrating element 70 and an inner surface 33 of the element mounting member 10 is narrowed as a piezoelectric device 60 is miniaturized.SOLUTION: An element mounting member 10 includes: a substrate 20 having an upper surface 21 and a lower surface 22; a frame body 30 having an upper end surface 31, a lower end surface 32, an inner surface 33 and an outer surface 34, the lower end surface 32 being integrated with the peripheral edge of the upper surface 21; an electrode pad 40 provided on the upper surface 21 and coated with a liquid conductive adhesive 41 from a needle of a dispenser; and a cutout portion 50 provided on the inner surface 33 so as to be recessed toward the outer surface 34 side and capable of inserting the needle when applying the conductive adhesive 41 to the electrode pad 40.SELECTED DRAWING: Figure 1
Inventors:
SAITO TOSHIHIRO
Application Number:
JP2016206653A
Publication Date:
April 26, 2018
Filing Date:
October 21, 2016
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H03H9/10; H01L23/04
Attorney, Agent or Firm:
Isamu Takahashi
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