Title:
PLASMA PROCESSING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP2018107026
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide plasma processing devices and methods, capable of achieving thermal plasma processing in which thermal plasma is radiated to process an inner wall surface of a processed cylinder, such as a cylindrical body. By supplying gas into a gap 28 between an outer wall surface 2e of a dielectric cylinder 2 and an inner wall surface 25e of a cylindrical base material 25 and by supplying high frequency power to coils 4a, 4b provided inside the dielectric cylinder, plasmas 29, 30 are generated in an annular space so that the inner wall surface of the base material is processed, the annular space being surrounded by the inner wall surface of the base material and annular grooves 23, 24 provided in the vicinity of the coils on the outer wall surface of the dielectric cylinder along a plane crossing the axis of the dielectric cylinder.SELECTED DRAWING: Figure 1
Inventors:
OKUMURA TOMOHIRO
Application Number:
JP2016254144A
Publication Date:
July 05, 2018
Filing Date:
December 27, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H05H1/30; C23C16/453; H05H1/24
Attorney, Agent or Firm:
Mitsuo Tanaka
Samejima Mutsumi
Hiroshi Okabe
Mitsuo Wada
Samejima Mutsumi
Hiroshi Okabe
Mitsuo Wada