Title:
A plasma treatment apparatus and a plasma processing method
Document Type and Number:
Japanese Patent JP6135455
Kind Code:
B2
Abstract:
A plasma processing apparatus for processing a substrate includes a turntable for orbitally revolving a substrate mounting area; a nozzle portion facing the substrate mounting area and having gas discharge ports for generating plasma; an antenna including a linear portion extending to cover a substrate passage area on a downstream side relative to the nozzle portion and a separated portion, wound around a vertical axis, and generating induction plasma in a process area to which the gas is supplied; a Faraday shield including a conductive plate provided between the antenna and the process area to cut off an electric field, and slits formed to orthogonally cross the antenna and cause a magnetic field to pass therethrough, wherein the slits are formed on aside lower than the linear portion and a portion of the conductive plate without the slits is positioned on a side lower than a curved portion.
Inventors:
Katohisashi Kato
Mihiro Shigehiro
Mihiro Shigehiro
Application Number:
JP2013222202A
Publication Date:
May 31, 2017
Filing Date:
October 25, 2013
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/205; C23C16/509; H01L21/316; H01L21/318; H05H1/46
Domestic Patent References:
| JP2012253313A | ||||
| JP2012227398A | ||||
| JP2013012761A | ||||
| JP2013161874A |
Foreign References:
| US20120267050 | ||||
| US20100096088 |
Attorney, Agent or Firm:
Toshio Inoue
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