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Title:
A plasma treatment apparatus and the tray for wafer conveyance
Document Type and Number:
Japanese Patent JP6088670
Kind Code:
B2
Abstract:
A plasma treatment apparatus includes a wafer transfer tray having a first surface and a second surface opposite to the first surface and configured to hold a wafer on the first surface, a cooling unit configured to cool the wafer transfer tray, a conductive supporter configured to support the second surface of the wafer transfer tray, and a double-surface electrostatic attractor configured to electrostatically attract the wafer to the first surface of the wafer transfer tray and electrostatically attract the supporter to the second surface of the wafer transfer tray.

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Inventors:
Toshiyuki Nakamura
Naoki Moriguchi
Ryuichiro Uemura
Yamato Nagata
Aihara Tsuyoshi
Application Number:
JP2015559091A
Publication Date:
March 01, 2017
Filing Date:
January 21, 2015
Export Citation:
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Assignee:
ULVAC, Inc.
International Classes:
H01L21/205; H01L21/673; H01L21/3065; H01L21/31; H01L21/683
Domestic Patent References:
JPH05259048A1993-10-08
JPH02135141U1990-11-09
JPH11168056A1999-06-22
JP2003100856A2003-04-04
JP2004031449A2004-01-29
JPH09162272A1997-06-20
JPH1079417A1998-03-24
JPH05259048A1993-10-08
JPH02135141U1990-11-09
JPH11168056A1999-06-22
JP2003100856A2003-04-04
JP2004031449A2004-01-29
Foreign References:
WO2011001978A12011-01-06
WO2011001978A12011-01-06
Attorney, Agent or Firm:
Masatake Shiga
Shingo Suzuki



 
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