Title:
白金ペースト
Document Type and Number:
Japanese Patent JP7305117
Kind Code:
B2
Abstract:
To provide a platinum paste capable of reducing the specific resistance of a produced conductive film and improving its heat resistance.SOLUTION: A platinum paste printed on a ceramic substrate, the platinum paste comprising (1) platinum powders, (2) ceramic powders, (3) a surfactant, (4) a resin, and (5) a solvent. The ceramic powders are composed of zirconia powders, titania powders, and alumina powders. A proportion of the zirconia powders in the ceramic powders is 17-80 mass%, a proportion of the titania powders in the ceramic powders is 3-72 mass%, and a proportion of the alumina powder in the ceramic powder is 5-66 mass%. The platinum paste contains 1-30 mass% of the ceramic powders based on a solid content of the platinum powders and the ceramic powders.SELECTED DRAWING: Figure 1
Inventors:
Yuta Watanabe
Tetsuro Kawabata
Yuta Takahashi
Tetsuro Kawabata
Yuta Takahashi
Application Number:
JP2019113711A
Publication Date:
July 10, 2023
Filing Date:
June 19, 2019
Export Citation:
Assignee:
Ishifuku Metal Industry Co., Ltd.
International Classes:
B22F9/00; B22F1/00; B22F1/107; H01B1/22
Domestic Patent References:
| JP2016100243A | ||||
| JP2230606A | ||||
| JP2017143202A |
Foreign References:
| CN103185738A |
Attorney, Agent or Firm:
Tomita Subsection
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