Title:
The polish control method and a device which have an eddy current supervising system and an optical supervising system
Document Type and Number:
Japanese Patent JP5980843
Kind Code:
B2
Abstract:
A chemical mechanical polishing apparatus has a polishing pad (30), a carrier (70) to hold a substrate (10) against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad (30) and carrier head (70) for generating relative motion therebetween. An eddy current monitoring system (40) is positioned to generate an alternating magnetic field in proximity to the substrate (10), an optical monitoring system (140) generates a light beam and detects reflections of the light beam from the substrate (10), and a controller (90) receives signals from the eddy current monitoring system (40) and the optical monitoring system (140).
Inventors:
Hanawa, Hiroji
Johansson, Nills
Swedek, Bogslaw, A.
Birang, Manucha
Redeker, Fritz, Sea.
Bajaju, Rajiv
Johansson, Nills
Swedek, Bogslaw, A.
Birang, Manucha
Redeker, Fritz, Sea.
Bajaju, Rajiv
Application Number:
JP2014121990A
Publication Date:
August 31, 2016
Filing Date:
June 13, 2014
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
G01B7/06; H01L21/304; B24B37/005; B24B37/013; B24B37/04; B24B49/00; B24B49/02; B24B49/04; B24B49/10; B24B49/12; G01B7/00; H01L21/283
Domestic Patent References:
| JP8285515A | ||||
| JP9330893A | ||||
| JP2001345292A |
Foreign References:
| WO1999066544A1 | ||||
| US5355083 |
Attorney, Agent or Firm:
Sonoda Yoshitaka
Kobayashi Yoshinori
Kobayashi Yoshinori
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