円柱状部材の研磨装置および円柱状部材の研磨方法

Japanese Patent JP5594295

B2

Provided are a polishing device and a polishing method for the polishing device, whereby workpieces comprising a hard and brittle material are machined into a cylindrical shape with a prescribed diameter, microcracks present on the surface layer of the workpieces are removed, and surface roughness is refined by removing surface irregularities. The polishing device is provided with: a clamping means that is connected to a workpiece rotation means, and that clamps both ends of the workpiece; a polishing means, the tip of which comes into contact with the outer surface of the workpiece and rotates, thereby polishing the outer surface of the workpiece; a moving means that moves the workpiece relative to the polishing means in a cylindrical-shaped axial direction of the workpiece; a height position detection means that detects the height position of a polished finished product and a workpiece to be polished; and a control means that carries out polishing by calculating the height positions and machining conditions that have been inputted. The polishing means is provided with at least one grindstone, and a polishing brush provided with a bristle material or an elastic body containing abrasive grains. The grindstone and polishing brush are positioned so as to be provided continuously along the axis of a cylindrical workpiece.

Masata Sawai
Shigeru Tanahashi
Masao Hirano

JP2011549090A

September 24, 2014

December 09, 2010

Click for automatic bibliography generation  

Sintokogio, Ltd.

B24B5/04; B24B29/00; B24D3/00; B24D13/14

JP2002292559A	2002-10-08
JP2003117800A	2003-04-23
JP2000094321A	2000-04-04
JP2000127005A	2000-05-09
JP2003094304A	2003-04-03
JPH0435865U	1992-03-25
JPH0636760U	1994-05-17
JP2002292559A	2002-10-08
JP2003117800A	2003-04-23

Yukuzo Yamazaki
Toshiaki Akamatsu
尾首 亘聰
Masako Okutani
Tadao Naito
Ordinary light Conscientious
Yoshiko Takeyama
Imai 千裕
Kei Kiuchi
Hiroaki Nishimura

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