Title:
研磨スラリーおよび半導体集積回路の製造方法
Document Type and Number:
Japanese Patent JP4564735
Kind Code:
B2
Inventors:
Yukie Mamaru
Katsuyuki Tsugita
Atsushi Hayashi
Takemiya Satoshi
Katsuyuki Tsugita
Atsushi Hayashi
Takemiya Satoshi
Application Number:
JP2003362035A
Publication Date:
October 20, 2010
Filing Date:
October 22, 2003
Export Citation:
Assignee:
Asahi Glass Co., Ltd.
AGC Seimi Chemical Co., Ltd.
AGC Seimi Chemical Co., Ltd.
International Classes:
H01L21/306; B24B37/00; C09K3/14; H01L21/304; H01L21/3205; H01L21/321; H01L21/768; H01L23/52; H01L23/522; H01L23/532
Domestic Patent References:
| JP2003124160A | ||||
| JP2001332518A | ||||
| JP2001196336A |
Attorney, Agent or Firm:
Hayashi Tsunetoku
Takamasa Asano
Kenji Doi
Takamasa Asano
Kenji Doi