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Title:
タングステンの蝕刻抑制剤を含むポリシング組成物
Document Type and Number:
Japanese Patent JP5571649
Kind Code:
B2
Abstract:
A chemical mechanical polishing composition and slurry comprising a composition capable of etching tungsten and at least one inhibitor of tungsten etching and methods for using the composition and slurry to polish tungsten containing substrates.

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Inventors:
Stephen Kay. グランバイン
Christopher See. ストレインツ
Eric W. G. Hoglund
Application Number:
JP2011272579A
Publication Date:
August 13, 2014
Filing Date:
December 13, 2011
Export Citation:
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Assignee:
Cabot Microelectronics Condominium ration
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14; C09K13/04; C09K15/20; C23F3/00; H01L21/306; H01L21/321
Attorney, Agent or Firm:
Aoki 篤
Ishida 敬
Tetsuji Koga
Satoru Ideno
Tomoyasu Nagasaka
Shunsuke Mitsuma



 
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